Core Viewpoint - The company plans to issue convertible bonds totaling no more than 1.5 billion yuan to unspecified investors, which will be convertible into the company's A-shares and listed on the Shanghai Stock Exchange [1] Fundraising Purpose - The raised funds will be used for the manufacturing projects of automotive-grade SiC MOSFET modules, IPM modules, and the industrialization of automotive-grade GaN modules, as well as to supplement working capital [1] Approval and Regulatory Process - The final issuance plan will be determined based on market conditions and the company's specific situation, requiring approval from the shareholders' meeting and registration with the Shanghai Stock Exchange and the China Securities Regulatory Commission [1]
斯达半导:拟发行15亿元可转债