HLGF(SH:600346) Zheng Quan Zhi Xing·2025-06-27 16:31Core Viewpoint - Hengli Petrochemical Co., Ltd. has successfully issued its first phase of technology innovation bonds for 2025, raising a total of 1 billion yuan at an interest rate of 1.85% [2][3]. Group 1: Bond Issuance Details - The company held a board meeting on April 9, 2024, to approve the registration for issuing short-term financing bonds, with a maximum amount of 3 billion yuan [2]. - The registration for the short-term financing bonds was accepted by the trading association, with a validity period of 2 years from the date of the notice [2]. - The technology innovation bonds were issued on June 25, 2025, with a total planned issuance of 1 billion yuan, which was fully realized [2]. Group 2: Bond Characteristics - The bond has a maturity of 365 days, with an interest start date of June 26, 2025, and a repayment date of June 26, 2026 [2]. - The bond code for the issued technology innovation bond is 042580325, and it was issued at a price of 100 yuan per 100 yuan face value [2]. - The main underwriter for this bond issuance is Industrial Bank Co., Ltd., with joint underwriters including China Merchants Bank Co., Ltd. and China Postal Savings Bank Co., Ltd. [2].