斯达半导拟再融资15亿元，投向SiC等3大车规器件项目

Core Viewpoint - Stada Semiconductor plans to issue convertible bonds totaling up to RMB 150 million to optimize its capital structure, support business development, and enhance market competitiveness [2] Group 1: Convertible Bond Issuance - The proposed convertible bonds will have a face value of RMB 100 each and will be issued at par, with a term of six years from the issuance date [2] - The interest rate for the bonds will be determined based on market conditions and discussions with the lead underwriter prior to issuance [2] - The conversion period for the bonds will start six months after issuance and last until the maturity date, with the initial conversion price set at no less than the average trading price of the company's stock over the last twenty trading days prior to the announcement [2] Group 2: Use of Proceeds - The funds raised will be allocated to several projects, including: 1. Automotive-grade SiC MOSFET module manufacturing project with a total investment of RMB 100,245.26 million, seeking RMB 60 million from the raised funds [3] 2. IPM module manufacturing project with a total investment of RMB 30,080.35 million, seeking RMB 27 million from the raised funds [3] 3. Automotive-grade GaN module industrialization project with a total investment of RMB 30,107.68 million, seeking RMB 20 million from the raised funds [3] 4. Working capital supplementation project with a total investment of RMB 43 million, seeking the full amount from the raised funds [3] Group 3: Financial Performance - The financial reports from 2022 to Q1 2025 show the following: - Revenue figures: RMB 270,549.84 million, RMB 366,296.54 million, RMB 339,062.07 million, and RMB 91,923.04 million [2] - Net profit figures: RMB 82,074.64 million, RMB 92,069.91 million, RMB 51,338.67 million, and RMB 10,485.51 million [2] - Debt-to-asset ratios: 19.45%, 23.44%, 30.09%, and 31.81% [2] - Current ratios: 8.91, 6.31, 3.83, and 3.62 [2] - Quick ratios: 7.70, 4.49, 2.55, and 2.36, indicating strong solvency [2]