芯碁微装年内股价涨31%拟赴港上市 加速国际布局海外市场收入增212%

Core Viewpoint - Chipbond Microelectronics (芯碁微装) plans to accelerate its internationalization strategy and overseas business layout by issuing H-shares and listing on the Hong Kong Stock Exchange, aiming to enhance its brand image, capital strength, and overall competitiveness [1][2][3]. Company Overview - Chipbond Microelectronics specializes in the research, development, manufacturing, and sales of direct imaging equipment and related maintenance services, focusing on micro-nano direct writing lithography technology [3]. - The company was listed on the STAR Market in April 2021, raising approximately 4.16 billion yuan after expenses for projects related to wafer-level packaging direct writing lithography equipment [3]. Financial Performance - In 2024, Chipbond Microelectronics achieved a revenue of 9.54 billion yuan, a year-on-year increase of 15.09%, but net profit decreased by 10.38% to 1.61 billion yuan due to high expenses related to overseas market strategies and talent development [5]. - The company reported a significant increase in overseas revenue, reaching 188 million yuan in 2024, a growth of 212.32% year-on-year, with Southeast Asia contributing nearly 20% to total revenue [1][4]. Market Position and Strategy - The global PCB industry is experiencing steady growth driven by artificial intelligence, high-speed networks, and electric vehicles, providing opportunities for Chipbond Microelectronics to strengthen its market position [6]. - The company has established strategic partnerships with international clients and is focusing on high-end market validation and delivery of its equipment [4][6]. Recent Developments - In the first quarter of 2025, Chipbond Microelectronics reported a revenue of 242 million yuan, a year-on-year increase of 22.31%, with net profit rising by 30.45% to 51.87 million yuan [5]. - The company signed contracts worth 146 million yuan for LDI exposure equipment, which is expected to positively impact future operating performance [6].