斯达半导拟发不超15亿可转债 2020上市两度募资共40亿

Core Viewpoint - The company, Sda Semiconductor, plans to issue convertible bonds to unspecified investors, aiming to raise up to RMB 150 million for various projects and working capital [1][2]. Group 1: Convertible Bond Issuance - The convertible bonds will be issued at a face value of RMB 100 each, with a term of six years from the issuance date [1]. - The initial conversion price will not be lower than the average trading price of the company's stock over the previous twenty trading days and the last trading day before the announcement [2]. - The issuance will be authorized by the company's shareholders and will involve negotiations with the lead underwriter regarding the final interest rate and issuance method [1][2]. Group 2: Fund Allocation - The total investment for the projects is RMB 203.43 million, with the following allocations: - Automotive-grade SiC MOSFET module manufacturing project: RMB 100.25 million, with RMB 60 million from the bond issuance - IPM module manufacturing project: RMB 30.08 million, with RMB 27 million from the bond issuance - Automotive-grade GaN module industrialization project: RMB 30.11 million, with RMB 20 million from the bond issuance - Working capital: RMB 43 million, fully funded by the bond issuance [3][2]. Group 3: Previous Fundraising Activities - The company raised a total of RMB 400.96 million from two previous fundraising activities, including an initial public offering and a private placement [5][4]. - The initial public offering raised RMB 50.96 million, with a net amount of RMB 45.95 million allocated to various projects [4]. - In 2021, the company conducted a private placement, raising approximately RMB 3.5 billion, with a net amount of RMB 3.48 billion after expenses [4].