国产GPU独角兽披露招股说明书，兼容国际和国产HBM颗粒，产品需求持续高涨

Core Viewpoint - Both Moore Threads and Muxi Co., Ltd. have announced that their IPO applications have been accepted by the Shanghai Stock Exchange on June 30, indicating a significant step in their market entry and potential growth in the semiconductor industry [1] Industry Summary - Moore Threads has introduced a pioneering Chiplet scalable architecture that supports flexible configurations of computing Die, HBM3e storage Die, and I/O Die, utilizing CoWoS 2.5D packaging combined with self-developed HBM controllers [1] - The global HBM supply is predominantly controlled by three major overseas players, with Samsung, SK Hynix, and Micron expected to remain the top three suppliers from 2024 to 2025, while domestic production is nearly non-existent [1] - According to Trendforce, the TSV production capacity for HBM in 2024 is projected to be 120,000 wafers per month for both Samsung and SK Hynix, and 25,000 wafers per month for Micron, with expected increases in 2025 [1] - The usage of HBM3e is anticipated to rise significantly, potentially reaching an 85% share by 2025, indicating a shift in technology adoption within the industry [1] Company Summary - Key players in the HBM equipment sector include Jingzhida, Huahai Qingke, Xinyuan Micro, Tuojing Technology, and Zhongwei Company [2] - Material suppliers in the HBM industry consist of Dinglong Co., Ltd., Yake Technology, Huahai Chengke, and Lianrui New Materials [2]