USC(SH:688403) Zheng Quan Zhi Xing·2025-07-01 16:07Summary of Key Points Core Viewpoint - The announcement provides an update on the conversion results of the convertible bonds issued by Hefei New Huicheng Microelectronics Co., Ltd., highlighting the limited conversion activity and the remaining unconverted bond amount. Group 1: Convertible Bond Issuance Overview - The company was approved to issue 11,487,000 convertible bonds at a face value of RMB 100 each, raising a total of approximately RMB 1.14 billion [2] - The bonds, named "Huicheng Convertible Bonds," have a conversion period from February 13, 2025, to August 6, 2030 [3] Group 2: Conversion Status - As of June 30, 2025, the total amount converted from the "Huicheng Convertible Bonds" is RMB 51,000, with a total of 6,612 shares converted, representing approximately 0.0008% of the company's total issued shares of 837,976,281 [1] - The amount of unconverted bonds as of the same date is RMB 1,148,649,000, accounting for 99.9956% of the total issuance [1] Group 3: Share Capital Changes - Prior to the conversion, the total number of shares was 837,981,982, which increased to 837,982,893 after the conversion of 911 shares [3]