台积电或将停产GaN 产线转做先进封装

Group 1 - TSMC is focusing on high-growth markets and has begun to reduce resources allocated to mature processes [1] - The company intends to exit the GaN market, with its wafer fab supplying GaN products only until July 1, 2027 [1] - After this date, the wafer fab will be repurposed for advanced packaging applications [1]