芯原股份完成18.07亿元定增

Core Viewpoint - Chiplet Solutions Platform Development: The company has completed a private placement of shares, raising a total of 1.807 billion yuan, which will be primarily used for the development of Chiplet solutions in the AIGC and smart mobility sectors, as well as for the R&D and industrialization of next-generation IP targeting AIGC and graphics processing applications [1] Summary by Relevant Categories - Fundraising Details - The company announced the completion of a private placement of shares, raising a total of 1.807 billion yuan [1] - Strategic Focus Areas - The raised funds will be allocated to multiple strategic directions, including the development of Chiplet solutions for AIGC and smart mobility [1] - The funds will also support the R&D and industrialization of next-generation IP for AIGC and graphics processing scenarios [1]