低成本融资窗口开启,银行发行科创债热情高涨
Core Insights - The issuance of technology bonds has significantly increased since the launch of the "Technology Board" in the bond market in May, with a total of 387 technology bonds issued by June 30, amounting to over 580 billion yuan [1] - The prevailing low interest rate environment and supportive policies have resulted in attractive coupon rates for technology bonds, with most bonds offering rates below 2% [1] - Small and medium-sized banks are leveraging technology bonds to expand their financing channels and reduce funding costs, which in turn supports local technology enterprises and enhances their brand influence in the capital market [1]