事关造车！这家A股公司，牵手天猫

Group 1 - Tmall and Shanzi Gaoke signed a strategic cooperation agreement to explore a new retail model for customized smart cars, leveraging Tmall's digital capabilities and Shanzi Gaoke's automotive industry advantages [1][2] - The first collaborative project, the V17 customized model, is currently in the prototype testing phase, aiming to integrate the entire process from online customization to data insights and smart manufacturing [1][2] - Tmall will provide Shanzi Gaoke with a digital analysis system that includes 10 core functional modules to enhance market demand insights, allowing consumers to participate in vehicle configuration directly through the Tmall platform [1][2] Group 2 - The initial phase of the collaboration will cover over 2,000 market insight data points, providing lifecycle data analysis support for the V17 model [2] - Tmall's automotive business leader emphasized that this partnership is a key implementation of Tmall's strategy to empower the industry through technology, leveraging insights from nearly 1 billion active users [2] - Shanzi Gaoke aims to accelerate its transition to user-driven manufacturing through this collaboration, with plans for further exploration in areas such as vehicle networking services and after-sales support [2][3] Group 3 - The partnership aligns with the implementation of the "Zhejiang Province Intelligent Connected Vehicle Industry Development Action Plan (2025-2027)," aiming to create a breakthrough paradigm in the smart connected vehicle industry [2] - Shanzi Gaoke plans to focus on three main directions by 2025-2026: completing the development and production of the V17 model, establishing an exclusive online sales channel through Tmall, and enhancing customer experience through a joint "Smart Automotive Consumer Insight Laboratory" [3] - Shanzi Gaoke, formerly known as Yinyi Co., has diversified into the new energy vehicle and semiconductor sectors, creating a high-end manufacturing ecosystem that includes smart connected vehicle manufacturing and advanced semiconductor packaging materials [3]