Group 1 - Chip Origin Co., Ltd. (芯原股份) successfully completed a private placement of A-shares, raising a total of 1.807 billion yuan by issuing 24.86 million shares at a price of 72.68 yuan per share [1] - The initial plan was to issue up to 50.09 million shares, indicating that the actual issuance was less than half of the maximum proposed [1] - The private placement involved 11 institutional investors, including major fund management companies and securities firms, with E Fund Management being the largest subscriber, contributing approximately 755 million yuan, accounting for 42% of the total raised [1][2] Group 2 - Chip Origin Co., Ltd. has previously raised a total of approximately 3.67 billion yuan through two rounds of equity financing, with the first round occurring during its IPO in August 2020 [2] - The funds raised from the latest private placement will be primarily allocated to research and development projects in the AIGC and smart mobility sectors, focusing on Chiplet solutions and new generation IP development [2] - The company specializes in providing platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing, with a portfolio of various processor IPs and over 1,600 mixed-signal and RF IPs [3] Group 3 - Despite its technological capabilities, the company faces financial challenges, with projected revenues of 2.338 billion yuan and 2.322 billion yuan for 2023 and 2024, respectively, alongside significant R&D expenditures [3] - The company reported a net loss of 296 million yuan in 2023 and is expected to incur a larger loss of 601 million yuan in 2024 [3] - In the first quarter of this year, the company achieved a revenue of 390 million yuan, reflecting a year-on-year growth of 22.49%, but still reported a net loss of 220 million yuan [3]
芯原股份18亿定增完成累募36.7亿 大股东易方达加码持股首季仍未扭亏