深南电路：PCB工厂产能利用率保持高位运行

Core Viewpoint - The company, Shenzhen Circuit (002916.SZ), reports that its PCB factory's capacity utilization remains high due to sustained demand in computing power and automotive electronics markets [1] Group 1: Business Operations - The overall business operations of the company are normal, with a comprehensive capacity utilization rate at a relatively high level [1] - The PCB business benefits from ongoing demand in computing power and automotive electronics, maintaining high factory capacity utilization [1] - The packaging substrate business has seen a relative improvement in demand from the storage sector, leading to an increase in capacity utilization compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development - The company has achieved mass production capability for FC-BGA packaging substrates with products of 20 layers and below, with minimum line width and spacing capabilities of 9/12μm [1] - Sample certification work for various product stages is progressing in an orderly manner [1] - The technical research and sample testing for products with more than 20 layers are on schedule [1]