Hwatsing Technology (SH:688120) Xin Lang Cai Jing·2025-07-03 12:28Group 1 - The company is implementing a "equipment + service" platform development strategy, with a high market share in CMP equipment and successful acceptance of multiple thinning machines and low-energy high-current ion implantation equipment [1][3] - The company plans to expand its wafer regeneration capacity to 600,000 pieces per month, benefiting significantly from the accelerated expansion trend of wafer fabs [1][3] Group 2 - The CMP equipment Universal-H300 has received bulk repeat orders and has achieved large-scale shipments, while specialized CMP equipment for third-generation semiconductor customers has been successfully developed and sent for client verification [1] - The thinning equipment covers various process customers, with the 12-inch ultra-precision wafer thinning machine Versatile-GP300 achieving multiple acceptances to meet customer mass production needs [2] - The company has established a series of cleaning equipment layouts covering large wafers and compound semiconductors, with the HSC-S1300 and HSC-F3400 cleaning equipment successfully verified and sold [2] Group 3 - The company has become a professional foundry for wafer regeneration with Fab equipment and process technology services, currently achieving a wafer regeneration capacity of approximately 200,000 pieces per month [2] - The company plans to build a wafer regeneration expansion project in Kunshan, Jiangsu Province, with a total planned capacity expansion of 400,000 pieces per month, and the first phase of construction capacity is expected to be 200,000 pieces per month with an investment not exceeding 500 million RMB [2] Group 4 - Revenue projections for the company are estimated at 4.503 billion, 5.860 billion, and 7.360 billion RMB for the years 2025 to 2027, with net profits of 1.290 billion, 1.682 billion, and 2.121 billion RMB respectively [3]