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债券型ETF新动向不断!首批科创债ETF快速“通关”,存量规模已破3800亿
Bei Jing Shang Bao·2025-07-03 14:20

Core Viewpoint - The approval of the first batch of 10 Science and Technology Innovation Bond ETFs marks a significant development in the bond ETF market, which has seen rapid growth in 2023, surpassing 380 billion yuan in total scale, with over 60% of net inflows in the ETF market attributed to bond ETFs [1][6][9]. Group 1: Approval and Launch of Science and Technology Innovation Bond ETFs - The first batch of 10 Science and Technology Innovation Bond ETFs has been officially approved, with a swift approval process of only half a month from the submission of materials [1][3]. - The fund managers of these ETFs have announced that the issuance will start on July 7, with a maximum fundraising scale of 3 billion yuan for each product [4]. - The ETFs will track various indices, including the China Securities AAA Technology Innovation Company Bond Index and the Shanghai Stock Exchange AAA Technology Innovation Company Bond Index [3][4]. Group 2: Growth of Bond ETFs - The total scale of bond ETFs has rapidly exceeded 380 billion yuan, with a significant year-on-year growth of 146.03% as of the end of the first quarter of 2023 [6][9]. - As of July 2, the bond ETF market consists of 29 products, and if the new Science and Technology Innovation Bond ETFs are successfully launched, the total will increase to 39 [6]. - The average annual return of bond ETFs has been stable, with 15 out of 29 products achieving returns exceeding 1% this year [9]. Group 3: Market Dynamics and Investor Sentiment - The growth of bond ETFs is driven by several factors, including their trading advantages, increased demand for safe-haven assets, and policy support [8]. - The bond ETF market has become a new focus for investors, with net inflows accounting for over 60% of total ETF net inflows this year [9]. - The Science and Technology Innovation Bond ETFs are expected to provide investors with convenient tools for allocating high-quality technology innovation company bonds [5][10].