弘信电子：拟发行不超过5亿元科技创新债券

Core Viewpoint - The company plans to issue technology innovation bonds to optimize its debt structure, reduce financial risks, and expand its operational scale [1] Group 1: Bond Issuance Details - The company will hold a board meeting on July 6, 2025, to review the proposal for issuing technology innovation bonds [1] - The maximum scale of the bond issuance is set at RMB 500 million (including 500 million) [1] - The issuance will be conducted through public or non-public targeted issuance, with a term not exceeding 3 years [1] Group 2: Financial Strategy - The specific term of the bonds will be determined by the company and the lead underwriter based on market conditions at the time of issuance [1] - The interest rate for the bonds will be set according to the market conditions of the interbank bond market at the time of each issuance [1]