弘信电子: 第四届董事会第四十二次会议决议公告

Group 1 - The company held its 42nd meeting of the 4th Board of Directors on July 6, 2025, with all 9 directors present, confirming the legality and validity of the meeting [1][2] - The Board approved a proposal to issue a total of up to RMB 500 million (including 500 million) in technology innovation bonds, with a term not exceeding 3 years [1] - The issuance aims to optimize the company's debt structure, reduce financial risks, and expand production and operational scale [1][2] Group 2 - The Board authorized the management team to decide and handle the issuance of the technology innovation bonds based on legal regulations and market conditions, prioritizing the interests of shareholders and creditors [2]