SCC(SZ:002916) Jin Rong Jie·2025-07-10 02:45Group 1 - The core viewpoint of the news is that Shenzhen Sunnan Circuit Co., Ltd. has applied for a patent for a manufacturing method of a packaging substrate, which aims to enhance the reliability of the packaging substrate by reducing the risk of damage to the internal conductive layer [1] - The patent application was filed on March 2025, and the public announcement number is CN120280345A [1] - The manufacturing method includes several steps, such as providing a packaging core board, forming solder pads, and ensuring the solder balls are positioned correctly to avoid damage [1] Group 2 - Shenzhen Sunnan Circuit Co., Ltd. was established in 1984 and is located in Shenzhen, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 51,287.7535 million RMB [2] - The company has made investments in 10 enterprises and has participated in 2,159 bidding projects, with a total of 1,608 patent information records [2]