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江丰电子: 向特定对象发行股票募集资金使用可行性分析报告

Fundraising Plan - The total amount raised from the issuance of shares will not exceed 1,947.83 million yuan, after deducting 20 million yuan for financial investments [1] - The funds will be allocated to projects including the production of electrostatic chucks and ultra-pure metal sputtering targets for integrated circuits [1][4] Project Details - The project for producing 5,100 electrostatic chucks aims to address the supply-demand imbalance in China's high-end electrostatic chuck market, enhancing the semiconductor supply chain's self-sufficiency [1][11] - The project for producing 12,300 ultra-pure metal sputtering targets will establish a production base in South Korea, enhancing service capabilities for major clients like SK Hynix and Samsung [4][10] - The Shanghai R&D and Technical Service Center project aims to improve the company's technological capabilities and competitiveness [12][13] Market Context - The global semiconductor industry is projected to grow significantly, with market sizes of approximately $526.9 billion in 2023 and $697.2 billion by 2025, driven by demand in AI, 5G, and IoT [7][8] - China's integrated circuit market is expected to grow rapidly, with a compound annual growth rate (CAGR) of 15.44% from 2018 to 2024 [15][16] Company Positioning - The company has made significant advancements in the ultra-pure metal sputtering target sector, reducing reliance on imports and achieving competitive parity with international leaders [8][9] - The company aims to enhance its global presence and competitiveness through the establishment of production facilities abroad [10][18] Financial Implications - The fundraising will support operational liquidity and debt repayment, optimizing the company's capital structure and reducing financial risks [24][26] - The implementation of these projects is expected to enhance profitability and market competitiveness, contributing to sustainable growth [25][26]