FHEC(SH:688362) Zheng Quan Zhi Xing·2025-07-13 08:12Overview - The company, Forehope Electronic (Ningbo) Co., Ltd., is issuing convertible bonds totaling RMB 116.5 million, with a total of 1,165,000 bonds to be listed on the Shanghai Stock Exchange [4][5][30]. - The bonds will have a maturity period from June 26, 2025, to June 25, 2031, with a conversion period from January 2, 2026, to June 25, 2031 [4][5]. Company Profile - Forehope Electronic was established on November 13, 2017, and focuses on integrated circuit packaging and testing, primarily serving integrated circuit design companies [9][18]. - The company specializes in advanced packaging technologies, including QFN/DFN, BGA, and WLP, and has developed a strong reputation in the market for its high-density packaging solutions [18][24]. Financial Information - The company has a registered capital of RMB 409,625,930 as of May 26, 2025, and has undergone several capital changes since its establishment [9][15]. - The total amount raised from the bond issuance will be used for projects including advanced packaging technology research and development [30]. Market Position - The integrated circuit packaging and testing industry is capital and technology-intensive, with high barriers to entry. Forehope competes primarily with leading domestic companies such as Changjiang Electronics Technology, Huatian Technology, and Tongfu Microelectronics [20][22]. - The company has established strategic partnerships with numerous well-known design firms, enhancing its market presence and customer base [25][26]. Competitive Advantages - Forehope has a strong focus on R&D, with 1,025 technical staff, representing 17.89% of its total workforce, and holds numerous patents in advanced packaging technologies [26][27]. - The company has been recognized as a high-tech enterprise and has received accolades from clients for its service quality and product reliability [25][26].