Core Insights - The company, Defu Technology, is leading the high-end copper foil industry in China through technological innovation and product breakthroughs, supporting the development of global new energy batteries, 5G communications, and artificial intelligence [1][3] Group 1: Technological Advancements - In 2024, Defu Technology's R&D investment reached 183 million yuan, a year-on-year increase of 30.45%, with 17 new invention patents added, covering next-generation battery technologies [1] - The company has achieved significant milestones in ultra-thin and functional copper foil, with products like 3.5μm ultra-thin copper foil and porous structure copper foil meeting the demands of all-solid-state battery technology [1] - The R&D team of 377 people has successfully tackled several critical technologies, leading to industry-leading capabilities in high-end copper foil localization [1] Group 2: Product Development and Market Position - In the electronic circuit copper foil sector, the HVLP1-2 ultra-low profile copper foil has completed small batch supply for applications in NVIDIA AI computing chips and 400G/800G high-speed optical modules [2] - The company has established long-term partnerships with leading global manufacturers, with high-end electronic circuit copper foil shipments increasing to 10.86% of total output [2] - The HVLP series copper foil features low signal loss characteristics, effectively supporting the transmission efficiency upgrades in data centers and AI computing infrastructure [2] Group 3: Strategic Focus and Future Outlook - Defu Technology is committed to a technology-driven market approach, utilizing its national-level R&D platforms to continuously push the boundaries of high-end copper foil technology [3] - The company is actively developing solutions for solid-state batteries and 6G communications, addressing challenges such as lithium metal anode dendrite growth and providing material solutions for high-frequency circuits [2][3]
德福科技以高端铜箔技术突破，赋能新能源与电子产业升级