Piotech (SH:688072) Zheng Quan Shi Bao Wang·2025-07-15 11:19Core Viewpoint - The company,拓荆科技, is a leading enterprise in the domestic semiconductor thin film deposition equipment and hybrid bonding equipment market, focusing on advanced technologies and product diversification to meet the growing demands of the semiconductor industry [1][2]. Group 1: Company Overview - 拓荆科技 has established two main product lines: semiconductor thin film deposition equipment and hybrid bonding equipment, which are essential for chip manufacturing alongside lithography and etching machines [1]. - The company is actively enhancing its product offerings in the three-dimensional integration field, including advanced bonding products and supporting measurement products [2]. Group 2: Product Development and Performance - The company has achieved mass production and repeat orders for its wafer-to-wafer bonding products, with key technical and capacity indicators meeting international standards [2]. - New products have been successfully integrated into advanced process chip production lines, and the company anticipates a significant improvement in gross margin by the second quarter of 2025 [3]. Group 3: Investment and Strategic Planning - 拓荆科技 has been investing in over ten companies within the semiconductor industry, including 恒运昌 and 新松半导体, to support the development of semiconductor equipment and components in China [3]. - The company is open to potential acquisitions of strategic targets that can create synergies and enhance its market competitiveness [3].