Sou Hu Cai Jing·2025-07-17 11:30Group 1 - SanDisk has abandoned plans to build a large chip manufacturing plant in Mundy, Michigan, leading to the failure of a $55 billion semiconductor manufacturing project that was expected to create up to 10,000 jobs in Genesee County [2] - The Michigan state government and economic developers worked for over a year to secure this investment, which was poised to be one of the largest in the state's history [2] - The U.S. aims to regain its status as a semiconductor manufacturing superpower through the $280 billion CHIPS and Science Act, which seeks to reduce reliance on foreign foundries [2] Group 2 - Intel plays a core role in establishing U.S. alternatives to foreign foundries but faces challenges following the sudden departure of former CEO Pat Gelsinger and the need for a new development strategy [3] - Micron Technology is prepared to compete with larger rivals SK Hynix and Samsung Electronics, showcasing its ability to produce advanced memory modules [3] Group 3 - Micron recently detailed its $200 billion investment plan in the U.S., which includes $150 billion for storage manufacturing and $50 billion for R&D, aiming to create approximately 90,000 direct and indirect jobs [4] - The $150 billion investment will fund the construction of a second leading memory factory in Boise, Idaho, and the expansion of existing facilities in Virginia and New York [4] - Micron's investment aims to meet anticipated market demand and support its goal of producing 40% of DRAM in the U.S. [4] Group 4 - Micron's first phase of investment involves building one of the largest and most advanced DRAM production facilities, Fab ID1, in Boise, Idaho, with a cleanroom area of 600,000 square feet [5] - Fab ID1 is expected to reach a key construction milestone by June 2025 and begin wafer production in the second half of 2027 [5] - A second facility, Fab ID2, will be constructed near ID1, benefiting from shared infrastructure and R&D co-location [5] Group 5 - Micron is also working on plans for up to four leading volume wafer fabs in New York, with a cleanroom area of approximately 600,000 square feet [6] - The New York project is more ambitious than the Idaho plan and aims to establish a strong domestic manufacturing footprint to support commercial and national computing needs [6]