VGT(SZ:300476) Ju Chao Zi Xun·2025-07-18 01:18Core Viewpoint - The announcement by Shenghong Technology regarding the approval of its stock issuance application marks a significant breakthrough in capital operations, laying a solid foundation for future business development [1] Group 1: Fundraising and Investment Allocation - The company plans to raise a total of no more than 1.98 billion yuan, with 900 million yuan allocated to the Vietnam Shenghong AI HDI project, 500 million yuan for the Thailand high-layer printed circuit board project, and the remaining 580 million yuan for working capital and repaying bank loans [1] - This funding allocation reflects the company's strategic focus on high-end manufacturing and global market expansion, as well as its emphasis on emerging technologies such as artificial intelligence [1] Group 2: Business Development and Industry Trends - Shenghong Technology highlights the increasing demands for PCB products driven by AI applications, necessitating advanced processing capabilities and high-precision control systems [1] - The company aims to enhance its R&D investment and upgrade production equipment to meet the technical requirements of high-end applications such as AI servers and GPU chips [1] - The decision to invest in Vietnam and Thailand aligns with the trend of the PCB industry shifting towards Southeast Asia, allowing the company to better meet core overseas customers' needs and capitalize on industry developments [2] Group 3: Market Environment and Strategic Insights - The timing of the fundraising coincides with favorable national policies encouraging high-end manufacturing and the rapid development of emerging technologies like AI and supercomputing, creating a broad market space for high-end PCB products [2] - The company recognizes the urgency of market competition, as overseas customers place high importance on implementation timelines, which justifies the need for rapid fundraising to accelerate overseas expansion [2] - Successful implementation of this issuance will provide ample funding support for R&D in high-end PCB products and global capacity layout, enhancing the company's competitiveness in high-end markets and solidifying its position in the international supply chain [3]