3月26日，大湾区ETF平安（512970）开盘涨1.73%，报1.472元。大湾区ETF平安（512970）重仓股方 面，中国平安开盘跌0.02%，立讯精密涨1.45%，比亚迪涨0.02%，招商银行跌0.28%，美的集团涨 0.12%，胜宏科技跌0.50%，汇川技术跌0.01%，工业富联跌0.62%，中兴通讯跌0.54%，迈瑞医疗跌 0.29%。 大湾区ETF平安（512970）业绩比较基准为中证粤港澳大湾区发展主题指数收益率，管理人为平安基金 管理有限公司，基金经理为白圭尧、王郧，成立（2019-09-23）以来回报为44.66%，近一个月回报 为-5.61%。 3月26日，大湾区ETF平安（512970）开盘涨1.73%，报1.472元。大湾区ETF平安（512970）重仓股方 面，中国平安开盘跌0.02%，立讯精密涨1.45%，比亚迪涨0.02%，招商银行跌0.28%，美的集团涨 0.12%，胜宏科技跌0.50%，汇川技术跌0.01%，工业富联跌0.62%，中兴通讯跌0.54%，迈瑞医疗跌 0.29%。 大湾区ETF平安（512970）业绩比较基准为中证粤港澳大湾区发展主题指数收益率，管理人为平安基金 ...

证券代码：300476 证券简称：胜宏科技 公告编号：2026-033 胜宏科技（惠州）股份有限公司 关于对子公司提供担保的进展公告 本公司及董事会全体成员保证公告内容的真实、准确、完整，没有虚假记载、误导性陈 述或重大遗漏。 一、担保情况概述 胜宏科技（惠州）股份有限公司（以下简称"公司"）于 2026 年 1 月 12 日、2026 年 1 月 28 日分别召开了第五届董事会第十二次会议和 2026 年第一次 临时股东会，审议通过了《关于 2026 年度担保额度预计的议案》，同意公司为 合并报表范围内部分全资子公司的融资提供担保，担保总额度预计不超过人民币 263,445 万元，担保额度在有效期内可循环滚动使用，任一时点的实际担保余额 不得超过上述额度。担保方式包括但不限于保证、抵押、质押等；担保金额、担 保期限、担保方式等具体担保条款，均以与债权人签订的最终协议为准。公司可 以根据实际情况，在上述额度范围内，在符合要求的担保对象之间进行担保额度 的调剂。担保额度期限自 2026 年第一次临时股东会审议通过后十二个月内有效。 具体内容详见公司在巨潮资讯网（www.cninfo.com.cn）披露的《关于 ...

Summary of Conference Call Records Industry Overview - The conference call focuses on the AI server and PCB (Printed Circuit Board) industry, particularly the advancements in materials and technology related to AI platforms and their components. Key Points AI Platform Upgrade - The new generation AI server architecture has shifted from "mid-board + CP board" to "switch backplane/orthogonal backplane + computing board," significantly increasing the requirements for backplane layers and material performance [1] - The Virtuoso cabinet inherits the GB300 design and upgrades materials, resulting in a 2x increase in PCB value, with each unit requiring 5 LPU cabinets and 1 CPU cabinet, all needing high-end PCBs [1] - This architectural adjustment is expected to increase PCB quantity by 2-3 times and value by 4-5 times, leading to a substantial rise in demand for copper-clad laminates (CCL) [1] Production Timeline - Core product mass production timelines are set: Rubin is expected to start mass production in Q3 2026, with PCB/CCL materials confirmed by late Q2 to early Q3; Alt in Q4 2026; and Fermi in the second half of 2027, with design completion in 2026 [1] Material Demand and Certification - M9 and M10 materials are projected to see explosive demand, with M9 CCL demand reaching millions of units by 2026 and increasing to 20-30 million units by 2027 alongside the Rubin platform [2] - M10 material certification has begun, with Nvidia requiring a loss factor (Df) of 0.0003. The competitive materials include PTFE (best electrical performance) and hydrocarbon resin + M10 filler, with PTFE outperforming M9 by 20%-30% [2] - M9 solutions have been confirmed, utilizing either "hydrocarbon resin + Q fabric" or "PTFE + fiberglass-free fabric," with a stable yield of 90% for M9 CCL, ready for mass production [2] Supply Chain and Pricing - The supply side is highly concentrated, with CTE fabric currently in severe shortage, priced at 120 RMB/kg, expected to rise further in 2026. New production capacity is anticipated to be released in the second half of 2026 [3] - Q fabric is primarily supplied by Asahi Kasei and domestic suppliers, with domestic prices 20%-30% lower than overseas [3] - Price increases for CCL are expected in 2025 due to rising costs of glass fabric and copper foil, with a projected 20%-30% increase in prices being passed down to end-users by April 2026 [3] PCB Market Dynamics - Due to the surge in PCB demand and value, existing suppliers are unable to meet capacity, prompting Nvidia to onboard new suppliers to ensure supply and reduce costs, with 2-4 suppliers per material number [4] - Key suppliers for LPU and CPU boards are identified, with a notable shift in market share towards new entrants like Jingwang Electronics and Dongshan Precision, while traditional players like Shenghong Technology see a decline in market share despite increased absolute order volumes [4] Copper Foil Specifications - Specifications for copper foil are being upgraded in line with material advancements, with M9 requiring HVP4 copper foil and M10 requiring HVP5/HVP6, with demand for HVP4 expected to reach 8,000-30,000 tons by 2027 [4] - Domestic manufacturers like Tongguan and Longdian Huaxin are accelerating the replacement of foreign suppliers due to price advantages [4] Market Potential - The market potential for CCL is significant, with GB300 cabinets requiring 50 CCLs and 60 PPs, while Rubin Ultra cabinets require 200 CCLs and 240 PPs. The value of core products is highlighted, with LPU boards valued at 20,000-30,000 RMB each and next-generation switch backplanes exceeding 800,000 RMB [5] - The global demand for M9 CCL is projected to reach 20-30 million units by 2027, corresponding to an area of over 20 million square meters, indicating a market size of several billion RMB [5] - Key beneficiaries across various segments are identified, including Shengyi Technology in CCL, Feilihua in electronic fabric, Jingwang Electronics in PCB manufacturing, and Tongguan Copper Foil in copper foil [5]

Summary of Key Points from the Conference Call Industry Overview - The conference focused on the **AI hardware, software, and cloud sectors** in China, highlighting the global AI investment cycle and its implications for various sectors and stocks [1][2][6]. Core Insights 1. **Global AI Investment Cycle**: - Investors are keen on identifying sectors and stocks that are well-positioned to benefit from the ongoing global AI investment cycle [1]. - The discussion emphasized the potential of **CPO (Co-package optics)** as a megatrend, with debates on its ability to replace traditional pluggable transceivers and copper cables in AIDC networking [1][2]. 2. **China's AI Value Chain**: - Investors are looking for opportunities in China's AI value chain, particularly in companies that are less exposed to geopolitical risks [1][6]. - Key beneficiaries identified include **Zhongji InnoLight (300308 CH)**, **Shengyi Technology (600183 CH)**, **Victory Giant (300476 CH)**, **Accelink (002281 CH)**, and **Shennan Circuits (002916 CH)**, all rated as "Buy" [1][11]. 3. **CPO Market Dynamics**: - CPO is expected to have a larger Total Addressable Market (TAM) in scale-up networks, but it is not anticipated to disrupt transceiver companies in scale-out networks [2]. - Leading transceiver companies like **InnoLight** and **Eoptolink** are expected to maintain strong fundamentals, with investors showing interest in the CPO value chain beneficiaries [2]. 4. **PCB/CCL Sector**: - The PCB/CCL sector in China is projected to benefit from volume upticks driven by GPU and ASIC platform upgrades starting in the second half of 2026 [3]. - Concerns about competition and stretched valuations were noted, with interest in both leading players and smaller companies that may gain market share [3][5]. 5. **China's Domestic AI Supply Chain**: - Investors are focusing on "local champions" in China's AI supply chain, which are less affected by the "de-coupling" trend [6]. - Companies like **Cambricon (688256 CH)** and LLM developers such as **Zhipu (2513 HK)** and **MiniMax (0100 HK)** are highlighted as potential investment opportunities [6]. 6. **Software Sector Concerns**: - There is a prevailing caution among investors regarding the software sector, particularly concerning the impact of LLMs on traditional software business models [7]. - While some believe the "LLM killing software" narrative is exaggerated, concerns about growth outlook and valuations persist [7]. Additional Important Insights - **Valuation Concerns**: Many investors expressed worries about stretched valuations across various sectors, particularly in optical components and software [2][3][7]. - **Supply Chain Bottlenecks**: Investors are actively seeking insights into supply bottlenecks and key beneficiaries in the upstream supply chain, especially in light of shortages in materials like glass fiber and copper foil [5][6]. - **Investment Timing**: Investors are waiting for more favorable entry points in the software sector, looking for signs of accelerating top-line growth and margin improvements before committing [7]. This summary encapsulates the key discussions and insights from the conference call, providing a comprehensive overview of the current landscape in the AI and related sectors in China.

红土创新科技创新股票型证券投资基金(LOF)（简称：红土创新科技创新股票(LOF)A，代码 501201）公布3月20日最新净值，上涨3.41%。 红土创新科技创新股票(LOF)A成立于2020年7月23日，业绩比较基准为中国战略新兴产业成分指数 收益率×50%+中证全债指数收益率×50%。该基金成立以来收益95.73%，今年以来收益29.92%，近一月 收益9.33%，近一年收益90.97%，近三年收益27.54%。近一年，该基金排名同类52/4411。 基金经理为盖俊龙。盖俊龙自2021年8月3日管理（或拟管理）该基金，任职期内收益-11.96%。 最新定期报告显示，该基金前十大重仓股如下： | 股票代码 | 股票名称 | 持仓占比 | 持仓股数（股） | 持仓市值（元） | | --- | --- | --- | --- | --- | | 300502 | 新易盛 | 9.60% | 20200 | 870.38万 | | 300308 | 中际旭创 | 9.56% | 14200 | 866.2万 | | 688498 | 源杰科技 | 8.75% | 12349 | 792.79万 | | 300 ...

证券代码：300476 证券简称：胜宏科技 公告编号：2026-032 胜宏科技（惠州）股份有限公司 关于签署募集资金四方监管协议的公告 本公司及董事会全体成员保证信息披露内容的真实、准确、完整，没有虚假记载、误导 性陈述或重大遗漏。 一、募集资金基本情况 为规范募集资金的存放、使用和管理，提高募集资金使用效率，保护投资者 权利，根据《上市公司募集资金监管规则》《深圳证券交易所创业板股票上市规 则》《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运 作》等法律、法规和规范性文件要求，以及公司《募集资金管理制度》的规定， 2025 年 9 月，公司及保荐机构国信证券股份有限公司与中国农业银行股份有限 公司惠阳支行、中国银行股份有限公司惠阳支行、中国工商银行股份有限公司惠 州惠阳支行、平安银行股份有限公司惠阳支行分别签署了《募集资金三方监管协 议》。具体内容详见公司于 2025 年 9 月 25 日在中国证监会指定信息披露网站巨 潮资讯网上披露的《关于签署募集资金三方监管协议的公告》（公告编号： 2025-106）。 2025 年 9 月 30 日公司召开第五届董事会第十次会议，审议通过了《关 ...

| 项目 | 工作内容 | | --- | --- | | 1. 公司信息披露审阅情况 | | | （1）是否及时审阅公司信息披露文件 | 是 | | （2）未及时审阅公司信息披露文件的次数 | 无 | | 2. 督导公司建立健全并有效执行规章制度的情 | | | 况 | | | （1）是否督导公司建立健全规章制度（包括 但不限于防止关联方占用公司资源的制度、募 集资金管理制度、内控制度、内部审计制度、 | 是 | | 关联交易制度） | | | （2）公司是否有效执行相关规章制度 | 是 | | 3. 募集资金监督情况 | | | （1）查询公司募集资金专户次数 | 每月查询 | | （2）公司募集资金项目进展是否与信息 | 是 | | 披露文件一致 | | | 公司治理督导情况 4. | | | （1）列席公司股东会次数 | 未列席，已阅会议文件 | | （2）列席公司董事会次数 | 未列席，已阅会议文件 | | 5. 现场检查情况 | | | （1）现场检查次数 | 次 0 | | （2）现场检查报告是否按照本所规定报送 | 不适用 | | （3）现场检查发现的主要问题及整改情况 | 不适用 | | 发 ...

Core Insights - The demand for PCB is driven by scale, speed, and integration, with a focus on the progress of substrate integration, backplane development, and optical-copper fusion [3][6] - The data center PCB market is projected to grow from $12.5 billion in 2024 to $23 billion by 2030, with a CAGR of 10.7% from 2024 to 2030 [13] - Key technological advancements include substrate integration with CoWoP, backplane applications in Kyber racks, and the integration of optical systems in EOCB [18][23][34] PCB Sector - The expansion of computing clusters is leading to increased demand for high-layer, high-density, and high-speed interconnect PCBs [6][12] - The integration of complex functions through substrate and backplane technologies is enhancing PCB capabilities [6][12] - The introduction of CoWoP technology by Nvidia aims to improve signal integrity and reduce power loss, although challenges remain in mSAP process and supply chain constraints [18][19] CCL Sector - The transition to M9-M10 specifications is driven by the need for higher speed and cost-driven price increases [5][37] - The dielectric performance of CCL must be upgraded to ensure signal integrity as speeds and frequencies increase [5][37] - The main materials for CCL are expected to see significant price increases due to supply constraints and rising demand from AI applications [58][63] Key Companies - Key players in the PCB sector include Huadian Co., Shennan Circuit, Shenghong Technology, and others, with a focus on high-layer and high-density PCB production [76] - Huadian Co. is a core supplier for switches and ASIC PCBs, while Shennan Circuit leads in data communication PCBs and packaging substrates [76] - Shenghong Technology is involved in Nvidia's interconnect definitions, focusing on capacity expansion and breakthroughs in ASIC and switch technologies [76] Investment Opportunities - The report highlights the importance of monitoring the progress of high-speed CCL certification and the sustainability of price increases [3][5] - Companies like Huadian Co. and Shenghong Technology are positioned to benefit from advancements in AI and high-speed interconnect technologies [76] - The focus on high-end materials and technologies in the PCB and CCL sectors presents significant investment opportunities as demand continues to rise [58][63]

本文字数：885，阅读时长大约1分钟 作者 | 一财阿驴 3月19日，A股三大指数集体收跌。沪指跌1.39%，深成指跌2.02%，创业板指跌1.11%，科创综指跌2.3%。 Wind显示，全市场近5000股下跌。 2026.03. 19 | 代码 名称 | 现价 涨跌 涨跌幅 | | --- | --- | | 000001 上证指数 | 4006.55 c -56.43 - -1.39% | | 399001 深证成指 | 13901.57 c -286.23 -2.02% | | 881001 万得全A | 6552.56 c -142.06 -2.12% | | 000680 科创综指 | 1689.34 c -39.78 -2.30% | | 399006 创业板指 | 3309.10 c -37.26 - -1.11% | 能源金属板块调整，威领股份跌停，永兴材料跌超8%，华友钴业、盛新锂能、融捷股份跌超6%。 沪深两市成交额2.11万亿元，较上一个交易日放量650亿元。 【资金流向】 主力资金全天净流入公用事业、计算机、通信等板块，净流出电子、基础化工、国防军工等板块。 具体到个股来看，九安医疗、 ...

3月19日股市早报 一、重要财经信息 ①3月18日全市场有7只主动权益基金成立(以普通股票基金和偏股混合基金为统计口径)，其中有5只募集规模超10 亿元。 2026年以来募集规模在10亿元以上的主动权益基金，已接近40只。 3月19日股市早报 一、重要财经信息 ①3月18日全市场有7只主动权益基金成立(以普通股票基金和偏股混合基金为统计口径)，其中有5只募集规模超10 亿元。 2026年以来募集规模在10亿元以上的主动权益基金，已接近40只。 ②伊朗南帕尔斯石油化工设施遭美国和以色列袭击。 伊朗报复打击利雅得炼油厂美方专属区域，卡塔尔拉斯拉凡工业城遭袭击。 ③中东战火点燃化工涨价链。 ②伊朗南帕尔斯石油化工设施遭美国和以色列袭击。 伊朗报复打击利雅得炼油厂美方专属区域，卡塔尔拉斯拉凡工业城遭袭击。 < 巴斯夫周三宣布，欧洲多类化工品最高涨价30%，化工巨头本月初已经对塑料添加剂提价。 ④美股三大指数集体收跌，道指跌1.64%，纳指跌1.46%，标普500指数跌1.36%。 ⑤国际油价上涨，WTI原油期货收于每桶96.32美元，涨幅为0.11%；布伦特原油期货收于每桶107.38美元，涨幅为 3.83%。 ⑥国 ...