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中芯国际申请存储单元结构及形成方法专利,减少存储单元结构横向尺寸
Sou Hu Cai Jing·2025-07-26 03:12

Group 1 - Company "SMIC International Integrated Circuit Manufacturing (Beijing) Co., Ltd." applied for a patent titled "Storage Unit Structure and Method for Forming Storage Unit Structure" with publication number CN120379260A, filed on January 2024 [1] - The patent abstract describes a storage unit structure that includes a substrate, bit line structure, source line structure, and various gate structures, which facilitate vertical electron transport channels and reduce the lateral dimensions of the storage unit [1] Group 2 - "SMIC International Integrated Circuit Manufacturing (Beijing) Co., Ltd." was established in 2002, located in Beijing, with a registered capital of 100 million USD, and has participated in 52 bidding projects and holds 5000 patent records [2] - "SMIC International Integrated Circuit Manufacturing (Shanghai) Co., Ltd." was founded in 2000, located in Shanghai, with a registered capital of 244 million USD, has invested in 4 companies, participated in 127 bidding projects, and holds 150 trademark records along with 5000 patent records [2]