国信证券：AI服务器浪潮驱动高端覆铜板产业升级 高端市场迎来结构性机遇

Group 1 - The high-end copper-clad laminate (CCL) market is experiencing structural opportunities due to the rapid increase in AI server shipments and the upgrade of ordinary server CCLs [1][2] - The demand for high-performance servers is continuously expanding, driven by the increasing number of layers required in server iterations and the growing need for high-speed CCLs [2][3] Group 2 - Electronic resin significantly impacts the performance of copper-clad laminates, with the focus on reducing dielectric loss by minimizing the content of polar functional groups in the resin [3] - Commonly used resins in high-end CCLs include biphenyl resin, polyphenylene ether resin, and hydrocarbon resin, with hydrocarbon resin being a key development focus due to its excellent properties [3] Group 3 - The dielectric performance of glass fiber and the polarization rate of its components are closely related, with companies adjusting glass formulations to balance electrical performance and processing difficulty [4] - The next generation of glass fiber is expected to use quartz fiber, which will significantly enhance properties but also increase processing difficulty [4]