Core Viewpoint - Chengdu High-tech Innovation Investment Development Group successfully issued the first phase of corporate bonds aimed at supporting small and micro enterprises in the technology innovation sector, marking a significant financial innovation in the Southwest region [1] Group 1 - The bond issuance is the first in the Southwest region to combine "technology innovation" and "support for small and micro enterprises" [1] - The bond has a record low coupon rate of 2.05%, the lowest for a 5-year private bond in the Midwest region [1] - The total issuance scale of the bond is 1 billion yuan, with a flexible term set at 5+3+2 years [1] Group 2 - The funds raised from the bond will be specifically used to support the development of small and micro enterprises in the technology innovation field [1] - The initiative aims to empower small and micro enterprises with core technologies, facilitating the transformation of technological achievements and industrial upgrades [1] - Chengdu High-tech Group is a state-owned investment and financing platform in Chengdu High-tech Zone, and this bond issuance is a key step in building a "technology-industry-finance" virtuous cycle system [1] Group 3 - The successful issuance of this bond represents a breakthrough in the dual-label innovative bond category of "technology innovation bond + small and micro enterprise support bond" in the Southwest region [1] - The bond aims to address the challenges faced by technology-oriented small and micro enterprises, such as "difficult financing and expensive financing" [1] - The issuance serves as a demonstration case for local financial innovation to support the real economy and for state-owned enterprises to deepen industrial transformation [1]
西南首单,科技创新中小微企业支持公司债券落地成都高新区
Sou Hu Cai Jing·2025-07-31 09:37