Core Insights - Zhizhi Boyue recently completed a multi-million Pre-A round financing led by several institutions, including Xianfeng Changqing and Dingxing Quantum, with Wanshi Capital serving as the exclusive financial advisor [1] Group 1: Company Overview - Zhizhi Boyue was established in 2022 in Shaanxi, initially focusing on military special materials, and now centers on proprietary modification of base resins, covering high-end electronic materials across display panels, semiconductor packaging, and military applications [1] - The company has overcome significant challenges in controlling electronic-grade impurity ions, achieving uniform dispersion of fillers, and ensuring long-term reliability, with its first LCD packaging adhesive passing rigorous 1000-hour validation at BOE's 8.5 generation line [1] Group 2: Financing Purpose - The CEO of Zhizhi Boyue, Sun Jiuli, stated that the funds from this round will be primarily used for the expansion of production bases in South China, the Yangtze River Delta, and Sichuan, as well as for the introduction of high-end semiconductor packaging testing equipment and an increase of 30% in the R&D team to accelerate the iteration of next-generation high-reliability packaging materials [2] Group 3: Investment Rationale - Zhao Yang, a partner at Xianfeng Changqing, highlighted that Zhizhi Boyue has a clear technological migration path from military applications to semiconductors, with high technical barriers in proprietary resin modification and validation from leading panel manufacturers, which instills confidence in investing in domestic high-end packaging materials [3] Group 4: Investment Perspective - Wang Shuai, founder of Shandao Venture Capital Network, noted that this financing coincides with the government's recent policies promoting the synergy between advanced manufacturing and venture capital, with Zhizhi Boyue entering the semiconductor materials sector using military-grade processes, thereby enhancing the supply chain and demonstrating the entrepreneurial spirit of tackling tough challenges [4]
商道创投网·会员动态|致知博约·完成数千万元Pre-A轮融资
Sou Hu Cai Jing·2025-07-31 15:57