华天科技：公司没有CoWoP封装技术
Tianshui Huatian Technology (SZ:002185) Mei Ri Jing Ji Xin Wen·2025-08-01 05:29Group 1 - The company has indicated that its eSinC 2.5D packaging technology platform includes SiCS, FoCS, and BiCS, which are comparable to CoWoS technology [2] - The company does not possess CoWoP packaging technology [2]