华天科技：拟20亿元设立2.5D/3D集成电路封装测试公司 抢抓先进封装市场先机

Group 1 - The company plans to establish a wholly-owned subsidiary, Nanjing Huaten Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan [1] - The investment will be contributed by Huaten Jiangsu (1 billion yuan, 50%), Huaten Kunshan (665 million yuan, 33.25%), and Advanced No. 1 (335 million yuan, 16.75%) [1] - The new company will focus on 2.5D/3D integrated circuit packaging and testing, aiming to seize opportunities in the advanced packaging market and enhance the company's competitive capabilities [1]