有研粉材：公司的散热铜粉是与某头部终端用户合作开发的产品，现已成功应用于部分GPU散热器件

Core Viewpoint - The company has successfully developed and applied its heat dissipation copper powder in certain GPU cooling devices, with positive feedback on its performance in various applications, including AI computing servers and telecommunications equipment [2]. Group 1: Product Development and Application - The company's heat dissipation copper powder is a product developed in collaboration with a leading end-user and has been successfully applied in some GPU cooling devices [2]. - The copper powder is categorized under air cooling, while liquid cooling is based on thermal conduction, indicating that both methods can work synergistically in certain applications [2]. - The copper powder has been partially applied in AI computing servers, base stations, large routers, and switches, with good feedback on its application performance so far [2]. Group 2: Market Potential and Future Outlook - The potential for large-scale application of the copper powder will depend on whether downstream users will promote its use in more application scenarios [2].