精研科技(300709.SZ)：拟发行可转债募资不超5.78亿元 投资于新型消费电子与数据服务器精密MIM零部件及组件生产项目等

Group 1 - The core viewpoint of the article is that Jingyan Technology (300709.SZ) has announced a plan to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding 577.89 million yuan [1] - The net proceeds from the fundraising, after deducting issuance costs, are intended to be invested in projects related to the production of precision MIM components and assemblies for new consumer electronics and data servers [1] - Additional investments will be directed towards the construction of the company's headquarters and R&D center, as well as a precision mold center [1]