晶合集成拟发H股 2023年A股上市募99.6亿共分红1.94亿

Group 1 - The company, Jinghe Integrated Circuit (688249.SH), is planning to issue H-shares and list on the Hong Kong Stock Exchange to enhance its international strategy and competitiveness [1] - The H-share listing is aimed at optimizing the capital structure and expanding financing channels, with discussions ongoing with relevant intermediaries [1] - The listing will not change the controlling shareholder or actual controller of the company [1] Group 2 - Jinghe Integrated Circuit was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on May 5, 2023, with an initial public offering (IPO) of 501,533,789 shares, representing 25.00% of the total share capital post-issue [2] - After the full exercise of the over-allotment option, the total number of shares issued increased to 576,763,789, accounting for 27.71% of the post-issue total [2] - The IPO raised a total of 996.05 million yuan before the over-allotment option and 1,145.45 million yuan after, with net proceeds of 972.35 million yuan and 1,118.76 million yuan respectively [2] Group 3 - The total issuance costs for the IPO were 23.69 million yuan before the over-allotment option and 26.69 million yuan after [3] - The underwriting and sponsorship fees amounted to 19.73 million yuan before and 22.69 million yuan after the over-allotment option [3] Group 4 - The company announced on April 15, 2024, that it would not distribute profits for the 2023 fiscal year [4] - A cash dividend of 0.10 yuan per share (including tax) is proposed for June 12, 2025, with a total cash dividend payout of approximately 194.40 million yuan [4]