新股消息 | 创智芯联拟港股IPO 中国证监会要求说明是否计划继续推进A股上市及具体安排等情况

Group 1 - The China Securities Regulatory Commission (CSRC) has requested additional information from Chuangzhi Xinian regarding its A-share listing application, including the reasons for previous withdrawal and future plans for the A-share listing [1] - Chuangzhi Xinian has submitted a listing application to the Hong Kong Stock Exchange, with Haitong International, Jianyin International, and China Merchants Securities International as joint sponsors [1] - The CSRC has also asked for clarification on the company's and its subsidiaries' qualifications for road cargo transportation and the compliance of technology export activities over the past three years [1] Group 2 - The company is a provider of metallization interconnection plating materials and key process technologies, focusing on wafer-level and chip-level packaging, as well as PCB manufacturing [2] - Chuangzhi Xinian has developed a complete product matrix for chemical plating and electroplating materials, covering applications in wafer-level packaging, chip-level packaging, and PCB manufacturing [2] - According to Frost & Sullivan, the company is the largest domestic supplier of wet process plating materials in the Chinese market by revenue in 2024 and the largest one-stop plating solution provider in China [2]