CHIPPACKING(SH:688216) Zheng Quan Zhi Xing·2025-08-11 11:14Core Viewpoint - The report highlights the financial performance and operational status of Qipai Technology Co., Ltd. for the first half of 2025, indicating a slight increase in revenue but a significant increase in net losses compared to the previous year. Financial Performance - The company's revenue for the first half of 2025 was approximately 325.91 million yuan, representing a 4.09% increase from 313.10 million yuan in the same period last year [3][15]. - The total profit for the period was a loss of approximately 62.66 million yuan, compared to a loss of 51.17 million yuan in the previous year [3][15]. - The net profit attributable to shareholders was a loss of approximately 58.67 million yuan, worsening from a loss of 40.60 million yuan year-on-year [3][15]. - The net cash flow from operating activities was approximately 14.11 million yuan, down 62.33% from 37.45 million yuan in the previous year [3][15]. - The company's net assets at the end of the reporting period were approximately 597.18 million yuan, down 8.64% from 653.63 million yuan at the end of the previous year [3][15]. Industry Overview - The semiconductor packaging and testing industry is experiencing a recovery, with global semiconductor market sales reaching 59 billion USD in May 2025, a year-on-year increase of 27% [5][7]. - The global semiconductor market is projected to grow to 718.9 billion USD in 2025, reflecting a 13.2% year-on-year increase [5][7]. - The demand for AI chips is expected to drive an 8% growth in the packaging and testing industry, with increasing needs for high-reliability and miniaturized packaging in automotive electronics and IoT [7]. Business Operations - The main business of the company includes semiconductor packaging and testing, divided into integrated circuit packaging testing, power device packaging testing, and wafer testing [5][8]. - The company has developed over 300 types of packaging forms, including MEMS, FC, GaN RF devices, and various traditional and advanced packaging technologies [8][13]. - The company emphasizes continuous R&D investment, with a total R&D expenditure of approximately 26.02 million yuan in the first half of 2025, a 2.50% increase year-on-year [16]. Competitive Advantages - The company has established a strong competitive edge through its proprietary technologies in packaging, including GaN microwave RF packaging and high-density matrix packaging technologies [18][19]. - The company has a well-structured team with extensive experience in semiconductor packaging and testing, contributing to its innovation and operational efficiency [19][20]. - The company operates a flexible production model that allows for quick adjustments to production plans based on customer orders, enhancing market responsiveness [20][21].