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6月11日申购新股!新恒汇IPO网上路演成功举行

Core Viewpoint - The company Xin Heng Hui is positioning itself as a leading player in the integrated circuit packaging materials sector, leveraging its technological innovations and commitment to quality service in the global market [1][2]. Company Overview - Xin Heng Hui is an integrated circuit enterprise that focuses on the research, production, sales, and testing services of chip packaging materials. Its main business areas include smart card operations, etching lead frame business, and IoT eSIM chip testing services [1]. - The company has developed over 120 patents and software copyrights and has established national standards for integrated circuit card packaging frameworks [1]. IPO Details - The company successfully held an online roadshow for its initial public offering (IPO) on June 10, with key executives participating alongside representatives from the underwriting firm, Founder Securities [1]. - Xin Heng Hui plans to issue 59.888867 million new shares, accounting for 25% of the total shares post-IPO, with an offering price of 12.80 yuan per share. The subscription date is set for June 11, and payment is due by June 13 [3]. Fund Utilization - The funds raised from the IPO will primarily be allocated to the industrialization upgrade of packaging materials and the construction of a research and development center. This is expected to enhance the company's global competitiveness and facilitate a transition towards intelligent services [3].