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新恒汇：公司推出了物联网QFN/DFN封装、MP2封装等新产品或服务 满足下游物联网客户的需求
HENGHUI Technology Corporation LimitedHENGHUI Technology Corporation Limited(SZ:301678) Quan Jing Wang·2025-08-13 05:51

Group 1 - The core viewpoint of the article is that Xinhenghui (301678) successfully held an online roadshow for its initial public offering (IPO) and listing on the ChiNext board on June 10 [1] - The company introduced new products and services in the field of IoT eSIM chip packaging, including IoT QFN/DFN packaging and MP2 packaging, to meet the needs of downstream IoT customers [1]