弘信电子拟发行不超5亿元科创债

Group 1 - The core point of the news is that Hongxin Electronics plans to issue a technology innovation bond with a maximum scale of 500 million yuan to improve its cash flow and liquidity management, while benefiting from market-based pricing mechanisms to lower financing costs [1] - The issuance of technology innovation bonds is supported by multiple government departments, with significant enthusiasm from various entities since the announcement of supportive measures in May 2023 [1] - As of July 3, 2023, the market has issued 419 technology innovation bonds with a total scale exceeding 620 billion yuan since the policy was implemented [1] Group 2 - Hongxin Electronics has expanded its business into AI computing servers in 2023, aiming to create a second growth curve alongside its traditional flexible printed circuit board (FPC) business [2] - In 2024, Hongxin Electronics achieved a revenue of 5.875 billion yuan, a year-on-year increase of 68.91%, and turned a profit with a net profit of 56.82 million yuan [2] - The revenue from traditional FPC and backlight module sales was 3.8 billion yuan in 2024, a year-on-year increase of 12.6%, while revenue from computing-related businesses surged to 1.988 billion yuan, a 53-fold increase, accounting for 33.84% of total revenue [2] Group 3 - To meet the funding needs for business growth, Hongxin Electronics is diversifying its financing channels, including plans for a private placement to raise 300 million to 600 million yuan from its actual controller, with all proceeds intended for working capital [3]