分析师:iPhone 18的A20 芯片将采用WMCM技术

Core Viewpoint - The A20 chip in the iPhone 18 will utilize TSMC's wafer-level multi-chip module (WMCM) packaging technology, moving away from the current integrated fan-out (InFO) packaging method [1] Group 1: Chip Technology Changes - The A20 chip is expected to be manufactured using TSMC's 2nm process, which will provide higher performance compared to the A18 and A19 chips that use TSMC's 3nm process [1] - The A20 chip may occupy less space in the iPhone compared to previous chips, potentially enhancing the overall design and efficiency of the device [1] Group 2: Impact on Performance and Battery Life - The changes in the A20 chip are anticipated to significantly improve Apple Intelligence's performance and extend battery life through enhanced energy efficiency [1]