金田股份：自主研发的铜热管、液冷铜管等产品已导入多家头部企业算力服务器产品中

Core Insights - The development of the AI industry has significantly increased the demand for chip computing power, positioning copper as a core material for advanced chip interconnection and heat dissipation due to its excellent conductivity and thermal properties [1] Company Overview - The company has a solid customer base and technical reserves in the chip computing power sector, being one of the earliest companies globally to provide copper-based materials in bulk to leading enterprises in this field [1] - The company's high-precision shaped oxygen-free copper busbar products, known for their high thermal conductivity and excellent welding and processing performance, have been successfully mass-produced in new AI cooling structures [1] - Strategic partnerships have been established with several top-tier cooling module companies, with applications in multiple high-end GPU cooling solutions [1] - The company has independently developed copper heat pipes and liquid-cooled copper pipes, which have been successfully integrated into the products of several leading enterprises in the computing server market [1]