生益电子：拟投资约19亿元用于智能制造高多层算力电路板项目

Core Viewpoint - The company plans to invest approximately 1.9 billion yuan in a smart manufacturing high-layer computing circuit board project, focusing on high-end market demands such as servers and AI computing [1] Investment Details - Total investment amount is about 1.9 billion yuan, which includes approximately 1.75 billion yuan in new investments [1] - The project will be implemented in two phases with a total construction period of 2.5 years [1] - Expected trial production starts in 2026 and 2027 [1] Project Focus - The project aims to meet the demand in high-end markets, specifically for servers, high-layer network communication, and AI computing [1] Funding Sources - The funding for the project will come from the company's own funds or self-raised capital [1] Potential Risks - The implementation of the project may face risks related to policy adjustments, project approvals, and uncertainties regarding market demand growth [1]