SHENGYI ELECTRONICS CO.(SH:688183) 智通财经网·2025-08-16 13:52Group 1: Market Trends and Growth - The PCB concept is experiencing significant activity, driven by increasing performance requirements for PCB products in AI servers, leading to a substantial rise in HDI market demand. The HDI market is expected to grow at a CAGR of 6.4% from 2024 to 2029, reaching a global market size of $17.037 billion by 2029 [1] - Major companies are reporting impressive earnings, with Shengyi Electronics (688183.SH) announcing a revenue of 3.769 billion yuan for the first half of 2025, a 91% year-on-year increase, and a net profit of 531 million yuan, up 452% [1] - Google disclosed a record high capital expenditure of $22.446 billion for Q2 2025, a 30.5% quarter-on-quarter increase and a 70.2% year-on-year surge, with a significant portion allocated to AI training and high-end servers [1] Group 2: Technological Advancements - The PCB industry is evolving towards high-frequency, lightweight, and lead-free technologies, with key materials like copper foil and electronic cloth gaining attention [2] - The current upward cycle in the PCB market is primarily driven by increased capital investments in AI hardware by international giants, with Nvidia leading the demand for high-density interconnect (HDI) technology [3][4] - The CoWoP (Chip-on-Wafer-on-Panel) process is transforming the role of PCBs from mere connectors to high-precision "inner substrates," necessitating advanced materials with low thermal expansion coefficients [5] Group 3: Supply Chain and Material Requirements - The production of Low-CTE glass cloth is highly concentrated, with few manufacturers capable of supplying it, including domestic leader Zhongcai Technology [6] - The CoWoP process demands high precision in PCB manufacturing, requiring advancements in laser direct imaging (LDI) and laser drilling equipment, with companies like Chipbase Microelectronics and Dazhong CNC leading in these technologies [7] - The demand for high-quality copper foil is increasing due to the skin effect in high-frequency circuits, with HVLP copper foil being developed to minimize signal loss [8] Group 4: Advanced Resin Development - The industry is shifting from traditional epoxy resins to advanced resin systems like PPO, PTFE, and BMI to meet the demands of high-frequency applications, with PTFE offering superior electrical performance but at a higher manufacturing cost [9][10]