20亿！华天科技又上新项目

Core Viewpoint - Huada Technology is establishing Nanjing Huada Advanced Packaging Co., Ltd. with a registered capital of 2 billion yuan, integrating its three core segments to capitalize on the explosive growth in the global advanced packaging market [1] Company Summary - Huada Technology is consolidating its subsidiaries, Huada Jiangsu, Huada Kunshan, and Huada Advanced No. 1 Fund, to form a new entity focused on advanced packaging [1] - The company is adopting a "cash + heavy asset" investment model, with Huada Jiangsu contributing land, real estate, and machinery, while Huada Kunshan and the Advanced No. 1 Fund provide cash support [1] - The establishment of Nanjing Huada Advanced is expected to create new business growth opportunities for the company and positively impact the semiconductor packaging and testing industry [1] Industry Summary - The global advanced packaging market is experiencing explosive growth, with major players like TSMC, Intel, and Samsung increasing their investments [1] - It is predicted that by 2027, the advanced packaging market will surpass traditional packaging for the first time [1] - The development of Nanjing Huada Advanced is anticipated to enhance domestic 2.5D/3D advanced packaging testing technology and contribute to the overall competitiveness of China's semiconductor industry [1]