Group 1 - The company issued a technology innovation corporate bond (Phase 1) from August 18 to August 21, 2023, with the bond code 148431 and name "23 招路 K1" [1][2] - The bond has a maturity date of August 21, 2025, with interest payments scheduled from August 21, 2024, to August 20, 2025, and the principal will be repaid in a lump sum at maturity [1][2] - The bond's coupon rate is set at 2.69%, resulting in an interest payment of RMB 26.90 per 1,000 yuan face value, with net payments after tax for individual and institutional investors specified [2][3] Group 2 - The bond's interest payment will be made to all registered holders as of the close of trading on August 20, 2025, at the Shenzhen Stock Exchange [2][3] - The company will entrust China Securities Depository and Clearing Corporation Limited Shenzhen Branch to handle the interest payments [3] - Tax obligations for bond interest income are outlined, with a 20% personal income tax rate applicable to individual bondholders, while foreign institutional investors are temporarily exempt from certain taxes until December 31, 2025 [4]
招商公路: 2023年面向专业投资者公开发行科技创新公司债券（第一期）2025年付息公告