商道创投网·会员动态｜芯擎科技·完成超10亿元B轮融资

Core Insights - Hubei Chipking Technology Co., Ltd. has completed a B-round financing exceeding 1 billion RMB, backed by government funds from Hubei and Shandong, along with multiple insurance and banking institutions [2] - The company focuses on automotive-grade high-performance chips and has launched the first domestic 7nm smart cockpit chip "Longying No. 1" and advanced driver assistance chip "Xingchen No. 1" [2] - The funding will be used to enhance the R&D of 7nm and more advanced process chips, expand global automotive testing centers, and deepen collaboration with OEMs and ecosystem partners [3] Investment Rationale - The investment is driven by the team's combination of international chip manufacturing experience and local market knowledge, positioning them to compete with leading overseas companies [4] - The rapid increase in domestic electric vehicle penetration and government support for a self-controlled supply chain further strengthens the investment case for Chipking Technology [4] Market Context - Recent initiatives from the Ministry of Industry and Information Technology and the National Development and Reform Commission have emphasized the importance of automotive chip development, with local governments responding quickly [5] - The participation of insurance and banking institutions reflects a strong expectation for returns from technology companies with competitive advantages [5] - The company's ambition to tackle the challenging 7nm automotive chip market is recognized, although it faces intense competition and must continue to innovate and operate steadily to succeed [5]