中石科技(300684.SZ)：产品目前暂未直接应用到芯片封装前的散热

Core Viewpoint - The company, Zhongshi Technology, has indicated that its products are not currently applied in the thermal management of chip packaging, but its high thermal conductivity pads and thermal gels are widely used in consumer electronics to address thermal dissipation issues [1] Group 1 - The company’s products include high thermal conductivity pads and thermal gels [1] - These products are primarily utilized in consumer electronic components [1] - The company has not yet applied its products directly to the thermal management of chip packaging [1]