Core Viewpoint - Yunnan Ge Industry announced that its subsidiary, Yunnan Xinyao Semiconductor Materials Co., Ltd., focuses on the production and sales of indium phosphide (InP) wafers and gallium arsenide (GaAs) wafers, highlighting the need for larger wafer sizes in the semiconductor materials industry [1] Group 1 - The main business of Yunnan Xinyao includes the production and sales of InP and GaAs wafers, which are part of the III-V compound semiconductor substrates [1] - Currently, the actual size specifications for InP wafers used by downstream customers globally range from 2 to 4 inches, with a focus on 2-inch and 3-inch wafers domestically [1] - The transition to larger wafer sizes faces uncertainties due to technological breakthroughs across the entire industry chain, as well as factors such as process reliability, cost, capacity, and market policies [1] Group 2 - Yunnan Xinyao has conducted research and development for larger wafer sizes after achieving mass production of 2-4 inch InP wafers, but there remains significant uncertainty from R&D to large-scale production [1] - Currently, there are no specific plans for the mass production of 6-inch InP wafers, and any future plans will be considered under controllable market and technical risks, with public disclosure required if such plans arise [1]
2连板云南锗业:公司及鑫耀公司目前并无6英寸磷化铟晶片规模化量产的具体计划