Xuan Gu Bao·2025-08-20 15:06Group 1 - Huawei is set to launch the Mate80 series with significant upgrades in design, performance, and imaging systems, marking a true iteration of the series [1] - The performance enhancement includes a "dual-track parallel" cooling solution that combines active fans and micro-pump liquid cooling, breaking through the technical boundaries of flagship device cooling and waterproofing [1] - The demand for efficient cooling solutions is increasing due to the rising power consumption of key components like chips, motherboards, and batteries, driven by advancements in AI technology [1] Group 2 - The micro-pump liquid cooling technology, which was introduced during the Mate60 period, utilizes high-performance phase change materials (PCM) to efficiently absorb and distribute heat [1] - The transition from passive to active cooling solutions is expected as mobile terminals face thermal load challenges, with micro-pump liquid cooling poised to revolutionize the cooling landscape in various product categories [1] - According to broker estimates, the market potential for active liquid cooling in mobile phones and laptops alone could exceed 100 billion [1] Group 3 - Nanxin Technology has launched the SC3601 piezoelectric micro-pump liquid cooling driver chip, which has been validated by multiple clients and is set for mass production [2] - Feirongda has introduced cooling devices and module products, including micro-pump liquid cooling modules, to meet customer demands [3]