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中芯国际申请半导体结构及其形成方法专利,降低了半导体结构中产生泄露电流的风险
Sou Hu Cai Jing·2025-08-23 11:02

Core Insights - Semiconductor manufacturing company SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," with publication number CN120529616A, filed on February 2024 [1] - The patent describes a semiconductor structure that includes a substrate with channel and source-drain regions, an insulating layer, a channel structure layer, a gate structure, and a source-drain doping layer [1] Company Overview - SMIC was established in 2000 and is located in Shanghai, primarily engaged in the manufacturing of computers, communications, and other electronic devices [1] - The company has a registered capital of 244 million USD [1] - SMIC has made investments in 4 companies, participated in 127 bidding projects, and holds 150 trademark records and 5000 patent records, along with 449 administrative licenses [1]